AI-Enabled Investigation of the Effect of PCB Thickness on Conversion Losses and Efficiency of a DC–DC Buck Converter Under Heatsink-Assisted Operation

Authors

Keywords:

Buck converter, PCB thickness, Conversion Loss, Conversion Efficiency, AI-based Analysis, Power Electronics, Thermal Management

Abstract

This paper presents an Artificial Intelligence–assisted simulation based on python algorithm to investigate the effects of FR-4 PCB thickness on conversion losses and conversion efficiency of a DC–DC buck converter operating with a heatsink. An XL4015-based buck converter delivering 5 V at 5 A from a 6–36 V input was used as case study and modeled over five PCB thicknesses (1.60 mm, 2.00 mm, 2.50 mm, 3.00 mm, 4.00 mm) while maintaining identical electrical components, copper weight, layout geometry, and switching frequency. The results obtained show that conversion loss decreased from 0.6016 to 0.3344 W at 6.00 V as the PCB thickness increased from 1.60 mm to 4.00 mm, and similarly, 0.5900 to 0.3299 W at 10.00 V, 0.5944 to 0.3316 W at 16.00 V, 0.6410 to 0.3498 W at 24.00 V, 0.7069 to 0.3756 at 30.00 V, 0.7998 to 0.4117 at 36.00 V,  indicating reduced energy losses due to increase in thermal pathway for heat dissipation as the PCB thickness increases, and the corresponding conversion efficiency increased from 97.65 to 98.68 % at 6.00 V, 97.694 to 98.698 % at 10.00 V, 97.678 to 98.691 % at 16.00 V, 97.5 to 98.62 % at 24.00 V, 97.25 to 98.52 % at 30.00 V, 96.9 to 98.38 % at 36.00 V, demonstrating improved conversion efficiency as the PCB thickness increases. The findings established PCB thickness as a decisive board-level efficiency parameter and provide quantitative guidance for power electronics thermal management in converter design.

Author Biographies

Michael Olusope Alade

Department of Pure and Applied Physics

Professor

Akinola Stephen Adewole

Department of Pure and Applied Physics

Postgraduate Student

Dimensions

Alade M. O. (2013). High Temperature Electronic Properties of a Microwave Frequency Sensor – GaN Schottky Diode. Advances in Physics Theories and applications, USA, 15 47 – 53. https://www.iiste.org

ANSYS Inc. (2020). Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages. ANSYS White Paper. https://www.4cadgroup.com/content/files/ansys-electro-thermal-mechanical.pdf

Dehong Xu, Rui Li, Ning He, Deng, Jinyi, & Yuying Wu. (2021). Soft-switching technology for three-phase power electronics converters (1st ed.) https://onlinelibrary.wiley.com/doi/book/10.1002/9781119602545?utm_medium=article&utm_source=researchgate.net

Edgar D. Silva-Vera,Jesus E. Valdez-Resendiz, Gerardo Escobar, Daniel Guillen, Julio C. Rosas-Caro, and Jose M. Sosa. (2024). “Data-Driven Modeling of DC–DC Power Converters,” Electronics, vol. 13, no. 19, p. 3890, 2024. https://doi.org/10.3390/electronics13193890

Erickson, R. W., & Maksimovic, D. (2020). Fundamentals of Power Electronics. (3rd edition) Springer Science and Business Media. https://scispace.com/pdf/fundamentals-of-power-electronics-57kz8pj23p.pdf

Holman, J. P. (2016). Heat Transfer (10th ed.). McGraw-Hill Education. https://www.tbooks.solutions/transfer-of-heat-j-p-holman-10ed

IEC 62368-1. (2018). Audio/Video, A Brief Overview of Information and Communication Technology Equipment – Part 1: Safety Requirements. International Electrotechnical Commission. https://www.ofca.gov.hk/filemanager/ofca/en/content_751/SSAC_Paper_7_2018.pdf

Infineon Technologies. (2019). Thermal Design and PCB Guidelines for Power Devices. Application Note.https://www.infineon.cn/assets/row/public/documents/24/42/infineon-eval-1ed3122mx12h-applicationnotes-en.pdf

Kumar S. N. (2018). Thermal Management PCBs for Power Electronics. https://www.researchgate.net/publication/322370341_Thermal_Management_PCBs_for_Power_Electronics

Lasance, C. J. M., & Poppe, A. (2017). Thermal Management for LED Applications. Springer.https://scispace.com/pdf/thermal-management-for-led-applications-11woljx97p.pdf

Lidow, A., Strydom, J., de Rooij, M., & Reusch, D., Glaser J. (2020). GaN Transistors for Efficient Power Conversion (3rd ed.), Wiley. https://app.knovel.com/kn/resources/kpGNTEPCE3/toc

Markus Andresen, Giampaolo Buticchi and Marco Liserre (2016). Active Thermal Control of Isolated Soft Switching DC/DC Converters. Industrial Electronics Society, IECON 2016-42nd Annual Conference of the IEEE. IEEE.https://www.researchgate.net/publication/312114815_Active_thermal_control_of_isolated_soft_switching_DCDC_converters

Mohan, N., Undeland, T. M., & Robbins, W. P. (2019). Power Electronics: Converters, Applications, and Design (4th ed.). Wiley. https://www.brownsbfs.co.uk/Product/Mohan-Ned/Power-Electronics/9781118734742

Park D.-R., and Kim, Y. (2021). Design and Implementation of Improved High Step-Down DC-DC Converter for Electric Vehicles. Energies, 14, 4206. https://doi.org/10.3390/en14144206

Rashid, M. H. (2018). Power Electronics: Circuits, Devices, and Applications (4th ed.). Pearson Education. https://www.scribd.com/presentation/414246615/Rashid-Ch01-Images

Rémy Caillaud, Cyril Buttay, Roberto Mrad, Johan Le Lesle, Florent Morel, Nicolas Degrenne, Stefan Mollov. (2019) Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 10 (2), https://hal.science/hal-02291493/file/RCL_ReviewPaper_V1.pdf

Staliulionis Ž., Zhang, Z., Pittini, R., Andersen, M. A. E., Noreika, A., & Tarvydas, P. (2020). Thermal modeling and design of on-board DC–DC power converter using finite element method. ELEKTRONIKA IR ELEKTROTECHNIKA, ISSN 1392-1215, Vol. 20. No. 10. http://dx.doi.org/10.5755/j01.eee

Stala R., Pilat A., Chojowski, M., Skowron M., and Folmer S. (2022). Thermal and electric parameter analysis of DC–DC modules, IEEE Trans. Ind. Electron., vol. 69, no. 4, pp. 3562–3572, 2022. https://doi.org/10.3390/en15197040

Sundeep A., Punit Goel, and A. Renuka (2023). Evaluating Power Delivery and Thermal Management in High-Density PCB Designs. International Journal for Research Publication & Seminar, 14(05), October–December 2023. https://doi.org/10.36676/jrps.v14.i5.1480

Talebian, I., Padar, N., Babaei, E., & Marzang, V. (2024). Study of a Reliable Buck Topology for High Step-Down DC-DC Power Conversion. In Proc. of PEDSTC. https://www.researchgate.net/publication/379875139_Study_of_a_Reliable_Buck_Topology_for_High_Step-Down_DC-DC_Power_Conversion

Texas Instruments, Introduction to EMI in Power Supply Designs, 2021. https://www.ti.com/lit/ml/slyp757/slyp757.pdf?ts=1773191558603

Wang, H., Ma, K., & Blaabjerg, F. (2018). Design for reliability of power electronic systems. IEEE Transactions on Power Electronics, 33(2), 1155–1170. https://doi.org/10.1109/TPEL.2017.2700043

Xinze Li, Zhang, Xin, Lin, Fanfan, & Frede Blaabjerg. (2021). Artificial-intelligence-based design for circuit parameters of power converters. IEEE Transactions on Industrial Electronics. https://arxiv.org/pdf/2308.05751

Published

2026-03-31

How to Cite

Alade, M. O., & Adewole, A. S. (2026). AI-Enabled Investigation of the Effect of PCB Thickness on Conversion Losses and Efficiency of a DC–DC Buck Converter Under Heatsink-Assisted Operation. Nigerian Journal of Physics, 35(1), 259-267. https://doi.org/10.62292/njp.v35i1.2026.504

How to Cite

Alade, M. O., & Adewole, A. S. (2026). AI-Enabled Investigation of the Effect of PCB Thickness on Conversion Losses and Efficiency of a DC–DC Buck Converter Under Heatsink-Assisted Operation. Nigerian Journal of Physics, 35(1), 259-267. https://doi.org/10.62292/njp.v35i1.2026.504

Most read articles by the same author(s)