Simulation-Based Analysis of the Breakdown Strength of Different Dielectric Materials: A Comparative Study of Polymers, Ceramics and Composites
DOI:
https://doi.org/10.62292/njp.v34i1.2025.365Keywords:
Dielectric, Breakdown strength, Dielectric materials, polymers, ceramics, composite materialsAbstract
In addition to the capacity to store and control electrical energy, dielectric materials are crucial to electrical and electronic engineering. These materials are distinguished by their insulating qualities, which are essential in circuit boards, capacitors, transformers and insulators, among other applications. This study presents a simulation-based analysis of the breakdown strength of various dielectric materials, focusing on polymers, ceramics, and composite materials using MATLAB. Dielectric breakdown strength is a critical parameter in determining the suitability of materials for high-voltage and high-frequency applications, such as power electronics, energy storage, and materials such as polyethylene (PE), polyimide (PI), alumina (Al2O3), barium titanate (BaTiO2), and epoxy-resin-based composites infused with nanoscale fillers like silica (SiO2) or carbon nanotubes (CNTs). The results highlight the unique strengths and limitations of these materials. Polymers like polyethylene exhibit high flexibility and process ability but are limited by thermal sensitivity. Ceramics, including alumina and barium titanate, offer exceptional thermal and electrical performance but suffer from brittleness. Composite materials demonstrate a balance of mechanical robustness and enhanced dielectric properties through tailored filler incorporation. This research identifies optimal material candidates with superior breakdown strength and provides valuable insights for the development of advanced dielectric systems in cutting-edge technologies, telecommunications. Using advanced simulation tools, this research evaluates and compares the dielectric breakdown mechanisms, thermal stability, and electrical performance of these materials, providing a comprehensive analysis of their applicability in advanced technologies such as telecommunications and power systems.
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